Semiconductor Process Reliability in Practice
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Proven processes for ensuring semiconductor device reliability
Proven processes for ensuring semiconductor device reliability
Co-written by experts in the field, Semiconductor Process Reliability in Practice contains detailed descriptions and analyses of reliability and qualification for semiconductor device manufacturing and discusses the underlying physics and theory. The book covers initial specification definition, test structure design, analysis of test structure data, and final qualification of the process. Real-world examples of test structure designs to qualify front-end-of-line devices and back-end-of-line interconnects are provided in this practical, comprehensive guide.
Coverage includes:
Basic device physicsProcess flow for MOS manufacturingMeasurements useful for device reliability characterizationHot carrier injectionGate-oxide integrity (GOI) and time-dependentdielectric breakdown (TDDB)Negative bias temperature instabilityPlasma-induced damageElectrostatic discharge protection of integrated circuitsElectromigrationStress migrationIntermetal dielectric breakdownFormat:Hardcover
Language:English
ISBN:007175427X
ISBN13:9780071754279
Release Date:October 2012
Publisher:McGraw-Hill Companies
Length:624 Pages
Weight:2.19 lbs.
Dimensions:1.3" x 6.0" x 9.0"
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