Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

By Xuejun Fan and John Lau

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Format:Hardcover

Language:English

ISBN:9819641659

ISBN13:9789819641659

Release Date:June 2025

Publisher:Springer

Length:645 Pages

Dimensions:6.1" x 9.3"

Related Subjects

Engineering Science Science & Math Science & Scientists Science & Technology Technology

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Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

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