Electronic Packaging and Interconnection Handbook
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Book Overview
Electronic packaging is the underlying technology behind the creation of small electronic devices such as cell phones, PDAs, and laptops. Packaging advances in this field have driven the miniaturization of consumer electronics. This is THE standard reference in the field, nearly 75% rewritten to reflect the tremendous advances that have taken place in the past five years. Contents: Fundamental Technologies;Materials for Electronic Packaging; Thermal Management of Electronic Packages; Shock,Vibration, and Operational Stress Management;Connector and InterconnectionsTechnologies; Soldering and Cleaning Technologies* Packaging and InterconnectionTechnologies; Single Chips Packaging and Ball Grid Arrays; Surface Mount Technology;Hybrid and Multichip Module Packaging; Chip Scale, Flip Chip, and Direct Chip Attachment,Rigid and Flexible Printed Wiring Boards * System Packaging Technologies;Packaging High Speed and Microwave Systems; Packaging High Voltage Systems; Packaging of MEMs Systems; Packaging ofOptoeletronic Systems
Format:Hardcover
Language:English
ISBN:0070266840
ISBN13:9780070266841
Release Date:January 1991
Publisher:McGraw-Hill Companies
Length:24 Pages
Weight:3.25 lbs.
Dimensions:1.9" x 6.4" x 9.3"
Customer Reviews
1 rating
A Professional writes a professional book
Published by Thriftbooks.com User , 25 years ago
I know Mr. Harper is well-known in electronic packaging field. His presentations have been read and studied in China. I think this book must be a best-seller in electronic packaging world. I wish I could buy one if it is possible in China.
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